
“ ïWave’s iW-Rainbow-G50 SOM, by utilizing the new OSM standard, ensures our latest processing technology is both accessible and applicable to a wider range of embedded applications.“ “The i.MX 93 applications processors deliver a strong combination of performance and power optimization to accelerate processing and machine learning at the edge,” said Justin Mortimer Senior Director Secure Connected Edge at NXP Semiconductors. “With billions of devices connected worldwide and the rise of AI on the edge, it is crucial to ensure safety, energy efficiency, and compute power,” said Immanuel Rathinam, Vice President – System on Modules at iWave.” NXP’s i.MX 93 OSM System on Module enables a new generation of intelligent devices across industrial, IoT, and automotive applications and speeds up time to market with reduced risk and complexity.” The availability of high-speed interfaces such as USB 2.0, Gbit ethernet, and CAN-FD makes the SoM ideal for industrial and automotive market segments.īuilding on the ML capabilities of NXP’s i.MX 93 applications processor, the SoM can be adopted by product companies as a powerful building block for machine vision, AIoT, Smart City, Industrial automation, and other ML-related applications. The SoM supports the MIPI-CSI camera interface to leverage the integrated NPU while supporting a 4-lane MIPI-DSI with 1080p60 resolution for 2D graphics processing through a high-efficiency pixel pipeline. With the ability to directly solder the SoM onto the carrier card, the SoM ensures high levels of robustness and is ideal for products prone to vibrations. The System on Module is built on a 45mm x 45mm OSM Size-L standard with the provision for 662 contacts, offering the highest pin-to-area ratio across SoM standards. Solderable LGA Package in OSM v1.1 Standard.2-Lane MIPI-CSI and 4-Lane MIPI-DSI Interface.NXP’s i.MX 93 SoC is the first in the industry to integrate the Arm® Ethos-U65 microNPU and the first in the i.MX Family to integrate the scalable Arm® Cortex®-A55 core features the latest Armv8-A architecture extensions with dedicated instructions to accelerate machine learning (ML). Evaluation Kits of the System on Module will be ready to purchase in March 2023.

The SoM incorporates NXP’s powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard, providing extensive interfaces in a rugged and compact form factor. IWave launches iW-RainboW-G50M: The Solderable NXP i.MX 93-based LGA System on Module (SoM).
